System-in-a-Package (SiP)

Zarlink's Advanced Packaging group's System-in-Package (SIP) technology enables fast low-cost integration of mixed-signal silicon technology and discrete components into an IC style package. SIP technology delivers significant reductions in both design cost and time-to-market over competing custom silicon options.


A unique feature of Zarlink's SIP technology is its inherent flexibility, allowing the easier integration of higher profile components (die stacking, filters, etc.) than what is typically found in molded SIP components.


Enhancing circuit and thermal performance capabilities with increased product reliability, our SIP technology delivers a competitive advantage for our customers by enabling smaller, smarter and more reliable solutions.

Download a Introduction to SIP presentation to learn more.