Fast and low cost alternative to System on a Chip (SOC)

Package outline: 23mm x 23mm *
Overall Height: 6mm *
Other package sizes available
Interconnection: 0.76mm solder balls
Ball count: 240 *
Ball pitch: 0.127mm
Substrate material: Isola G200 BT Epoxy *
Moisture Sensitivity : JEDEC Level 3
Packaging: JEDEC thick tray

Multi-layer BT Epoxy construction, with microvias
and matched impedance tracking.

Ceramic version DIL available

Mixed technology components including passives; modules; silicon; Also possible: Flip-chip; chip-stacking.

* Parameters apply to example shown