Advanced Packaging

Zarlink's Advanced Packaging division's key expertise allows its customers to get products to market faster, easier and cost-effectively.

Advanced Packaging's proven micro-packaging skills are behind smaller, faster and more reliable electronic components at the heart of mission-critical medical, telecom, industrial, and military applications. We've designed and assembled key technologies for ultra-reliable devices, including a module for the world's smallest pacemaker and in-body antennas for wireless healthcare devices. Working with leading telecom providers, we have developed circuit solutions that deliver enhanced performance and a reduce board footprint versus individual integrated circuits.

Advanced Packaging's end-to-end expertise includes integrated evaluation, design and development capabilities, supported by manufacturing facilities meeting the strictest medical and telecom standards, to help our customers improve performance, lower costs and ensure fast time-to-market.

What's NEW IN ADVANCED PACKAGING

  1. Apr 11, 2007 - Zarlink Joins Consortium Developing "Smart Flex" Packaging for the Miniaturization of Electronic Systems

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Conference Papers

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